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Intel Lakefield: Intel announces first ‘Lakefield’ chips; to power thin, light PCs and laptops


Intel’s new Intel Core processors with Intel Hybrid Technology, code named Lakefield, are here. The new chips,…Read More

Intel’s new Intel Core processors with Intel Hybrid Technology, code named Lakefield, are here. The new chips, Core i5-L16G7 and i3-L13G4, leverage the company’s Foveros 3D packaging technology and hybrid CPU architecture for power and performance scalability. According to Intel, Lakefield processors are the smallest to deliver Intel Core performance and full Windows compatibility across productivity and content creation experiences for ultra-light and innovative form factors. In simple term, the new chips are aimed at thin-and-light PCs and laptops as well as those in new form factor like foldable.
Lenovo ThinkPad X1 Fold is the first-fully functional PC with a folding OLED display to run on these chips. Unveiled at CES 2020, the foldable PC is likely to ship later this year. Intel-based Samsung Galaxy Book S too runs on these new chips. The laptop launched in select markets recently.
“Intel Core processors with Intel Hybrid Technology are the touchstone of Intel’s vision for advancing the PC industry by taking an experience-based approach to designing silicon with a unique combination of architectures and IPs. Combined with Intel’s deepened co-engineering with our partners, these processors unlock the potential for innovative device categories of the future,” says Chris Walker, Intel corporate vice president and general manager of Mobile Client Platforms.
The new Intel Core processors can deliver full Windows 10 application compatibility in up to a 56% smaller package area for up to 47% smaller board size and extended battery life, providing OEMs more flexibility in form factor design across single, dual and foldable-screen devices.
Other than this, Intel claims that the new processors boasts of several firsts. One, they are first from the company to ship with attached package-on-package (PoP) memory, which further reduces board size. Two, the new Intel Core processors deliver as low as 2.5mW of standby SoC power, an up to 91% reduction compared to Y-series processors, or more time between charges. Three, these are also the first Intel processors to feature native dual internal display pipes, making them ideal for foldable and dual-screen PCs.
Intel Core i5 and i3 processors with Intel Hybrid Technology leverages 10nm Sunny Cove core to take on intense workloads and foreground applications, while four power-efficient Tremont cores balance power and performance optimization for background tasks. The processors are fully compatible with both 32- and 64-bit Windows apps.
With Foveros 3D stacking technology, processors achieve a dramatic reduction in package area – now only a miniscule 12x12x1 mm, approximately the size of a dime – by stacking two logic dies and two layers of DRAM in three dimensions, also eliminating the need for external memory.
Intel also claims that the chip enables real-time communication between the CPU and the OS scheduler to run apps on the right cores, the hybrid CPU architecture helps deliver up to 24% better performance per SOC power and up to 12% faster single-threaded integer compute-intensive application performance.
In May 2019, Intel had announced that chips will begin shipping by the end of 2019. It’s possible that coronavirus delayed the rollout.



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